Package with dies mounted on opposing surfaces of a leadframe

ABSTRACT

A package includes a leadframe having first surface and a second surface opposing the first surface, the leadframe forming a plurality of leads, a first semiconductor die mounted on the first surface of the leadframe and electrically connected to at least one of the plurality of leads, a second semiconductor die mounted on the second surface of the leadframe, wire bonds electrically connecting the second semiconductor die to the leadframe, and mold compound at least partially covering the first semiconductor die, the second semiconductor die and the wire bonds.

This application is a continuation of U.S. patent application Ser. No.16/221,291, filed Dec. 14, 2018, the contents of which are hereinincorporated by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to semiconductor packages.

BACKGROUND

Packaged power supply circuit assemblies can include power switchingdevices for converting direct current (DC) voltage to another DCvoltage. Some power converters include two powermetal-oxide-semiconductor field effect transistors (MOSFETs) connectedin series and coupled together by a common switch node; such an assemblyis also called a half bridge. When a regulating driver and controller isadded, the assembly is referred to as a synchronous buck converter. In asynchronous buck converter, the control field-effect transistor (FET)die, also called the high-side switch, is connected between the supplyvoltage VIN and the LC output filter. The synchronous (sync) FET die,also called the low side switch, is connected between the LC outputfilter and ground potential. The gates of the control FET die and thesync FET die are connected to a semiconductor die including thecircuitry for the driver of the converter and the controller; thisdriver integrated circuit (IC) is also connected to ground potential.

In some power switching devices, the dies of the power MOSFETs and thedriver IC are assembled horizontally side-by-side as individualcomponents. Each die is typically attached to a rectangular orsquare-shaped pad of a metallic leadframe; the pad is surrounded byleads as input/output terminals. In other power switching devices, thepower MOSFET dies and the driver IC are assembled horizontallyside-by-side on a single leadframe pad, which in turn is surrounded onall four sides by leads serving as device input/output terminals. Theleads are commonly shaped without cantilever extensions and arranged inthe manner of Quad Flat No-Lead (QFN) or Small Outline No-Lead (SON)devices.

The electrical connections from the dies to the leads may be provided bywires with wire bonds, which introduce, due to their lengths andresistances, significant parasitic inductance into the power circuit. Insome assemblies, clips substitute for many connecting wires. These clipsare wide and introduce reduced parasitic inductance. Each assembly istypically covered with mold compound, and the packaged components areemployed as discrete building blocks for board assembly of power supplysystems.

In some synchronous buck converters, the control FET die and the syncFET die are assembled vertically on top of each other as a stack, andwith clips providing the connections to the switch node and the stacktop. Such an example synchronous buck converter package is depicted aspackage 100 in FIG. 1 .

In package 100, control MOSFET 120 is stacked on sync MOSFET 130. QFNmetal leadframe 110 has a rectangular flat pad 111, which serves as theoutput terminal and as a heat spreader for package 100. Leads 114, 116are positioned in lines along two opposite sides of pad 111. FET dies120, 130 are each stacked in a source-down configuration: the source ofsync FET 130 is soldered to leadframe pad 111 by solder layer 131, andthe source of control FET 120 is soldered to low side clip 150 by solderlayer 121. Driver IC 140 is attached by solder layer 142 to pad 111horizontally side-by-side with sync FET 130.

Low side clip 150 and high side clip 160 are gang placed. Low side clip150 is soldered by solder layer 132 onto the drain of sync FET 130, and,as previously mentioned, is attached to source of control FET 120 bysolder layer 121. Consequently, low side clip 150 serves as the switchnode terminal of the synchronous buck converter. High side clip 160 isconnected by solder layer 122 to the drain of control FET 120. High sideclip 160 is also connected to the input supply VIN via a lead 116. Wirebonds 143 provide the connections to the die terminals and FET gateterminals 126, 134, 136. Mold compound 102 covers these electronics ofpackage 100, leaving contact areas of leads 114, 116 exposed tofacilitate electrical connections thereto and leaving rectangular flatpad 111 exposed to support heat spreading.

BRIEF SUMMARY

Packages disclosed herein include a first die on first surface of aleadframe in a flipchip arrangement and a second die on the opposingsecond surface of the leadframe, the second die utilizing wire bonds toconnect to the leadframe. Also disclosed are techniques formanufacturing such packages. In particular examples, the techniquesdisclosed herein are applied to synchronous buck converters with boththe control FET die and the sync FET die being on a first surface of theleadframe in flipchip arrangements and the driver IC being mounted tothe opposing second surface of the leadframe utilizing wire bonds toconnect to the leadframe. Such a configuration provides a stackedarrangement on opposing sides of a leadframe without the need for clips,which may both reduce the overall size of a package and reducemanufacturing costs as compared to other stacked arrangements, such asthose described with respect to FIG. 1 .

In one example, a package includes a leadframe having first surface anda second surface opposing the first surface, the leadframe forming aplurality of leads, a first semiconductor die mounted on the firstsurface of the leadframe and electrically connected to at least one ofthe plurality of leads, a second semiconductor die mounted on the secondsurface of the leadframe, wire bonds electrically connecting the secondsemiconductor die to the leadframe, and mold compound at least partiallycovering the first semiconductor die, the second semiconductor die andthe wire bonds.

In another example, a method of forming a package includes arranging afirst semiconductor die on a first surface of a leadframe in a flipchiparrangement, reflow processing the flipchip arrangement so that solderbumps form electrical connections between the first semiconductor dieand leads of the leadframe, mounting a second semiconductor die on asecond surface of the leadframe using die attach between the secondsemiconductor die and the second surface of the leadframe, the secondsurface opposing the first surface, forming electrical connectionsbetween the second semiconductor die and the leads of the leadframe toform wire bonds that electrically connect the first semiconductor dieand the second semiconductor die, and molding to at least partiallycover the first semiconductor die, the second semiconductor die, and thewire bonds using mold compound.

In another example, a package includes a leadframe having first surfaceand a second surface opposing the first surface, the leadframe forming aplurality of leads, a synchronous (sync) field effect transistor (FET)comprising sync FET contacts, and a control FET comprising control FETcontacts. The sync FET and control FET are arranged on the first surfaceof the leadframe such that the sync FET contacts and the control FETcontacts are each electrically coupled to at least one of the pluralityof leads. The package further includes a driver integrated circuit (IC)mounted on the second surface of the leadframe, wire bonds electricallyconnecting the driver IC to the leadframe to form a synchronous buckconverter including the driver IC, the control FET, and the sync FET,and mold compound at least partially covering the sync FET, the controlFET, the driver IC and the wire bonds.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of a synchronous buck converter with adriver IC assembled adjacent to vertically stacked FET dies and twoclips on a leadframe pad according to prior art.

FIG. 2A shows a top view of a conceptual synchronous buck converter withadjacent FET dies vertically stacked relative to the driver IC on asingle leadframe.

FIG. 2B shows a top view of the FET dies of the converter of FIG. 2Arelative to the leadframe.

FIG. 2C shows a cutaway side view of the converter of FIG. 2A includingflipchip arrangements between the FET dies and the leadframe and wirebonds between the driver IC and the leadframe.

FIGS. 3A-3D illustrate conceptual process steps for manufacturing asemiconductor package including a first die on first surface of aleadframe in a flipchip arrangement and a second die with wire bonds onthe opposing second surface of the leadframe.

FIG. 4 is flowchart of a method of manufacturing a semiconductor packageincluding a first die on first surface of a leadframe in a flipchiparrangement and a second die with wire bonds on the opposing secondsurface of the leadframe.

FIG. 5A shows a cutaway side view of a semiconductor package including afirst die in a flipchip arrangement on first surface of a leadframe anda second die with wire bonds on the opposing second surface of theleadframe, the package including an outer mold layer covering the firstand second dies.

FIG. 5B illustrates a conceptual process step for manufacturing asemiconductor package of FIG. 5A.

DETAILED DESCRIPTION

Packages disclosed herein include a first die on first surface of aleadframe in a flipchip arrangement and a second die on the opposingsecond surface of the leadframe, the second die utilizing wire bonds.Such techniques provide packages in a stacked arrangement without theneed for a clip layer, thereby facilitating smaller packages and reducedmanufacturing costs as compared to some other stacked arrangements, suchas those described with respect to FIG. 1 . In addition, the compactdesigns disclosed herein provide for short electrical connectionsbetween dies of a package, facilitating low impedance connectionsbetween the dies, which supports power efficiency and mitigates heatgeneration.

FIG. 2A shows a top view of a semiconductor package, synchronous buckconverter 200. Synchronous buck converter 200 includes the converterelectronics and mold compound 202 covering the converter electronics.The electronics of converter 200 include control FET die 220 and syncFET die 230 on a first surface of leadframe 210 in flipchiparrangements. In addition, driver IC 240 is vertically stacked relativeto dies 220, 230 on the opposing second surface of leadframe 210. DriverIC 240 utilizes wires 243 with wire bonds to connect to leadframe 210.

FIG. 2B shows a top view of dies 220, 230 in converter 200 relative toleadframe 210. FIG. 2C shows a cutaway side view of converter 200including a flipchip arrangement between dies 220, 230 and leadframe 210and wire bonds between driver IC 240 and leadframe 210.

Leadframe 210 forms leads 214, 216 positioned in lines along twoopposite sides of leadframe 210 and extend outward from mold compound202. In the configuration shown, leads 214, 216 form die attach siteswith electrical contact points corresponding to dies 220, 230. A dieattach site as referenced herein represents the contact areas forphysical and electrical connections to dies, such as dies 220, 230. Incontrast to leadframe 110, leadframe 210 does not include a rectangularpad surrounded by leads as input/output terminals. Due to position ofleadframe 210 within the stacked arrangement of converter 200, heatdissipation from such a central pad would be limited. In some examples,a such a rectangular pad could be added to leadframe 210, for example,to provide a larger mounting surface for attachment of dies 220, 230 toleadframe 210.

Leadframes, such as leadframes 110, 210, are formed on a single, thinsheet of metal as by stamping or etching. Multiple interconnectedleadframes may be formed on a single leadframe sheet, the interconnectedleadframes referred to as a leadframe strip. Leadframes on the sheet canbe arranged in rows and columns. Tie bars connect leads and otherelements of a leadframe to one another as well as to elements ofadjacent leadframes in a leadframe strip. A siderail may surround thearray of leadframes to provide rigidity and support leadframe elementson the perimeter of the leadframe strip. The siderail may also includealignment features to aid in manufacturing.

Usually die mounting, die to lead attachment, such as wire bonding, andmolding to cover at least part of the leadframe and dies take placewhile the leadframes are still integrally connected as a leadframestrip. After such processes are completed, the leadframes, and sometimesmold compound of a package, are severed (“singulated” or “diced”) with acutting tool, such as a saw or laser. These singulation cuts separatethe leadframe strip into separate IC packages, each IC package includinga singulated leadframe, at least one die, electrical connections betweenthe die and leadframe (such as gold or copper bond wires) and the moldcompound which covers at least part of these structures.

Tie bars and siderails may be removed during singulation of thepackages. The term leadframe of represents the portions of the leadframestrip remaining within a package after singulation. With respect toconverter 200, leadframe 210 includes leads 214, 216 although thoseelements are not interconnected following singulation of converter 200.

Leads 214, 216 form a recess 218. Recess 218 is of a depth such thatdies 220, 230 are coplanar relative to distal portions of leads 214, 216surrounding recess 218. The configuration of leadframe 210 and leads214, 216 may vary in other examples. For example, leads 214, 216 mayform a deeper recess such that dies 220, 230 are recessed relative todistal portions of leads 214, 216 surrounding the recess, as describedwith respect to package 500 (FIG. 5A). In other examples, leadframe 210,including leads 214, 216 may instead be substantially planar such thatdies 220, 230 extend beyond leads 214, 216 on one side of leadframe 210and driver IC 240 extend beyond leads 214, 216 on the opposing side. Inother examples, leads 214, 216 may instead form a recess containing allor a portion of driver IC 240.

Control FET die 220 includes source contact 224, drain contact 226, andgate contact 227. Similarly, sync FET includes source contact 234, draincontact 236, and gate contact 237. In various examples, dies 220, 230can be combined into a single monolithic die or two separate dies. Eachcontact of dies 220, 230 is electrically connected to the correspondingleads of leadframe 210. Specifically, the die attach site of leadframe210 for control FET die 220 includes a source contact, a drain contact,and a gate contact corresponding to source contact 224, drain contact226, and gate contact 227 of control FET die 220. Likewise, the adjacentdie attach site of leadframe 210 for sync FET die 230 includes a sourcecontact, a drain contact, and a gate contact corresponding to sourcecontact 234, drain contact 236, and gate contact 237 of sync FET die230.

Control FET die 220 is secured to the surface of leadframe 210 withsolder bumps 221 in a flipchip arrangement to form electricalconnections between source contact 224, drain contact 226, and gatecontact 227, and the corresponding leads at the die attach site forcontrol FET die 220. Likewise, sync FET die 230 is secured to the samesurface of leadframe 210 with solder bumps (not shown) in the flipchiparrangement to form electrical connections between source contact 234,drain contact 236, and gate contact 237, and the corresponding leads atthe die attach site for sync FET die 230. If control FET die 220 andsync FET die 230 are implemented as a monolithic die, the monolithic dieis secured the surface of leadframe 210 in a single flipchiparrangement, or if dies 220, 230 are implemented on separate dies, eachwould be secured the surface of leadframe 210 in separate flipchiparrangements.

Die attach 242 secures driver IC 240 to the opposite surface ofleadframe 210 relative to dies 220, 230. Die attach 242 is anonconductive die attach material, such as a nonconductive die attachpaste. Die attach 242 also serves as underfill for dies 220, 230. Dieattach 242 applied opposite dies 220, 230 flows around leads 214, 216 tofill the space between leadframe 210 and dies 220, 230. Leads 214, 216are configured to cover a majority of the area beneath dies 220, 230 toprovide sufficient adhesion strength for dies 220, 230 on leadframe 210through both the solder joints in the flipchip arrangement andunderfill.

Driver IC 240 includes a number of bond pads 244 attached to wires 243with wire bonds 241 electrically connecting driver IC 240 to the dieterminals and to dies 220, 230. Specifically, wires 243 with wire bondsconnect driver IC 240 to leads 214, 216 for both gate contact 227 ofcontrol FET die 220 and gate contact 237 of sync FET die 230 in order tocontrol switching of dies 220, 230 within converter 200. In someexamples, wire bonds 241 of wires 243 may represent a ball bond with astitch bond at leads 214, 216, or vice versa. Additional wires 243 withwire bonds connect driver IC 240 to additional leads 214, 216 for powerand communication connections with external components.

To facilitate the operation of synchronous buck converter 200, draincontact 226 of control FET die 220 connects to VIN via leads 214, 216 ofleadframe 210, and source contact 234 of sync FET die 230 connects toground via a leads 214 of leadframe 210. In turn, source contact 224 ofcontrol FET die 220 is connected to drain contact 236 of sync FET die230 via two coupled leads 214, which serve as the switch node terminalof converter 200. However, with a monolithic die, source contact 224 ofcontrol FET die 220 may be internally connected to drain contact 236 ofsync FET die 230, leaving only a single exposed bond pad to serve as theswitch node terminal of the converter.

Mold compound 202 provides a protective layer covering electronics ofconverter 200, including leadframe 210, driver IC 240, wires 243 andconnections therebetween. Mold compound 202 may be formed from anonconductive plastic or resin material. In some examples, mold compound202 is molded over the electronics of converter 200 in a transfermolding process. Mold compounds suitable for use as mold compound 202include, for example, thermoset compounds that include an epoxy novolacresin or similar material combined with a filler, such as alumina, andother materials to make the compound suitable for molding, such asaccelerators, curing agents, filters, and mold release agents.

Mold compound 202 only partially covers dies 220, 230, leaving exposedsurfaces of dies 220, 230 flush with mold compound 202 on the surface ofconverter 200. While mold compound 202 may be selected to facilitateheat dissipation during the operation of converter 200, the exposedsurfaces of dies 220, 230 may further facilitate heat dissipation byallowing direct contact between dies 220, 230 and air or a heat sink.Leads 214, 216 form a recess in which dies 220, 230 are located. In theexample shown, the distal ends of leads 214, 216, are approximatelycoplanar with the exposed outer surface of dies 220, 230. Such aconfiguration may facilitate supporting leads 214, 216 and dies 220, 230on a flat surface during the molding process.

FIGS. 3A-3D illustrate conceptual process steps for manufacturingsemiconductor package 300. FIG. 4 is flowchart of a method ofmanufacturing package 300. For clarity, the techniques of FIG. 4 aredescribed with respect to package 300 and FIGS. 3A-3D; however, thedescribed techniques may also be utilized in the manufacture of buckconverter 200.

Package 300 includes semiconductor die 320 mounted on a first surface311 of leadframe 310 in a flipchip arrangement, and semiconductor die340 mounted to the opposing second surface 312 of leadframe 310. Die 340utilizes wire bonds with wires 343 to connect to leads 314, 316 ofleadframe 310. In some specific examples, die 320 may represent controlFET die 220 and/or sync FET die 230 of buck converter 200, and die 340may represent driver IC 240 of buck converter 200.

FIG. 3A illustrates die 320 arranged on surface 311 of leadframe 310 ina flipchip arrangement (FIG. 4 , step 402). Leadframe 310 forms leads314, 316 positioned in line along two opposite sides of leadframe 310,as also illustrated with respect to leadframe 210 and leads 214, 216. Inthe flipchip arrangement, electrical contacts 324 of die 320 arepositioned on surface 311 of leadframe 310 to connect to leads 314, 316.

The flipchip arrangement is reflow processed so that solder bumps 321form electrical connections between die 320 and leads 314, 316 at thedie attach site of leadframe 310 (FIG. 4 , step 404). Leads 314, 316form a recess 318 in which die 320 is located such that the distal endsof leads 314, 316, are approximately coplanar with the exposed outersurface of die 320. Such a configuration facilitates supporting leads314, 316, and die 320 on a flat surface during the attachment of die 340as described with respect to FIG. 3B.

As shown in FIG. 3B, die 340 is mounted on surface 312 of leadframe 310,which opposes surface 311, using nonconductive die attach 342 (FIG. 4 ,step 406). Die attach 342 also serves as underfill between die 320 andsurface 311 of leadframe 310. Die attach 342 will have a maximumthickness equal to the spacing between die 320 and leadframe 310, plusthe thickness of leadframe 310, plus the spacing between die 340 andleadframe 210. In an example embodiment, leadframe 310 may have athickness of about 200 μm, the spacing between die 320 and leadframe 310may be about 75 micrometers (μall), and the spacing between die 340 andleadframe 210 may be about 75 μm, for a total maximum thickness of about350 μm. A single application of die attach can support a thickness of atleast 500 μm, which is suitable for this example.

As shown in FIG. 3C, wires 343 form electrical connections between bondpads 344 of die 340 and leads 314, 316 (FIG. 4 , step 408) with wirebonds 341. The wire bonding techniques should be selected to avoidadversely affecting electrical connections between die 320 and leads314, 316. For example, wire bonding should not heat solder bumps 321 totheir melting point. In some examples, solder bumps 321 may have amelting point of at least 230 degrees Celsius. Such examples may utilizewire bonding techniques at temperatures of about 180 degrees Celsius orless. In some specific examples, connections between bond pads 344 ofdie 340 and leads 314, 316 may occur with wedge bonds of gold-aluminum,which can bond at room temperature.

As shown in FIG. 3D, mold compound 302 is applied to cover die 340 andthe wire bonds between die 340 and leadframe 310. In addition, moldcompound 302 is applied to partially cover die 320, leaving die surfacesopposite leadframe 310 exposed and flush with mold compound 302 on anouter surface of package 300 (FIG. 4 , step 410). In some examples,applying mold compound 302 may include transfer molding.

While mold compound 302 may be selected to facilitate heat dissipationduring the operation of package 300, the exposed surface of die 320 mayfurther facilitate heat dissipation by allowing direct contact betweendie 320 and air or a heat sink. In some examples, the molding techniquesmay include applying tape to shield the exposed surface of die 320 frommold compound 302 prior to molding such that the exposed surface of die320 is flush with mold compound 302 on an outer surface of package 300.

In other examples, as shown with respect to semiconductor package 500(FIG. 5B), the mold compound may fully cover dies 320, 340, and the wirebonds formed with wires 343. In such examples, leads 314, 316 may form adeeper recess of sufficient depth such that die 320 is recessed relativeto portions of leads 314, 316 surrounding the recess in the flipchiparrangement, as shown in the example of package 500 (FIG. 5A). In otherexamples, leadframe 310, including leads 314, 316 may instead besubstantially planar, or leads 314, 316 may instead form a recesscontaining all or a portion of die 340.

In some examples, package 300 may be one of an array of packagesmanufactured on an array of interconnected leadframes 310. In suchexamples, the method further includes singulating the array of moldedpackages to form individual packages 300. Singulation may includecutting through mold compound 302 and tie bars linking theinterconnected leadframes 310 with a saw or other cutting implement.

FIG. 5A shows a cutaway side view of semiconductor package 500, and FIG.5B illustrates a conceptual process step for manufacturing package 500.Like package 300, package 500 includes semiconductor die 320 mounted toa first surface of leadframe 510 in a flipchip arrangement, andsemiconductor die 340 mounted to the opposing surface of leadframe 510.Die 340 utilizes wire bonds with wires 343.

Package 500 is substantially similar to semiconductor package 300 withthe exception of leadframe 510 replacing leadframe 310 and mold compound502 replacing mold compound 302. Elements of package 500 with the samenumbers as package 300 are the same or substantially similar to thoseelements in package 300. For brevity, such elements are described inlimited or no detail with respect to package 500.

Leads 514, 516 form a recess 518 surrounding die 320. Recess 518 is of asufficient depth such that die 320 is recessed relative to portions ofleads 514, 516 in the flipchip arrangement.

Following the attachment of die 320 to leadframe 510 in the flipchiparrangement, the attachment of die 340 to leadframe 510 could cause anundesirable bending force applied to the assembly of leadframe 510 anddie 320 during the application of die attach 342 and the placement ofdie 340. Such bending could break solder connections between leadframe510 and die 320 or break die 320 itself. For this reason, as shown inFIG. 5B, worksurface 550 is not planar, but includes platform 552 tosupport die 320 during the attachment of die 340 to leadframe 510 andduring wire bonding with wires 343.

Due to the depth of recess 518, mold compound 502 provides an outer moldlayer covering both die 320 and die 340 such that it fully covers bothdie 320 and die 340, rather than leaving an exposed surface of die 320.In this manner, mold compound 502 may provide further protection to die320 as compared to mold compound 302 of package 300.

The specific techniques for packages with a first die on first surfaceof a leadframe in a flipchip arrangement and a second die on theopposing second surface of the leadframe, the second die utilizing wirebonds, including techniques described with respect to buck converter200, semiconductor package 300, and semiconductor package 500, aremerely illustrative of the general inventive concepts included in thisdisclosure as defined by the following claims.

What is claimed is:
 1. A method of forming a package comprising:arranging a first semiconductor die on a first surface of a leadframe ina flipchip arrangement; reflow processing the flipchip arrangement sothat solder bumps form electrical connections between the firstsemiconductor die and leads of the leadframe; mounting a secondsemiconductor die on a second surface of the leadframe using die attachbetween the second semiconductor die and the second surface of theleadframe, the second surface opposing the first surface; formingelectrical connections between the second semiconductor die and theleads of the leadframe to form wire bonds that electrically connect thefirst semiconductor die and the second semiconductor die; and molding toat least partially cover the first semiconductor die, the secondsemiconductor die, and the wire bonds using mold compound.
 2. The methodof claim 1, further comprising applying the die attach as underfill forthe first semiconductor die between the first semiconductor die and thefirst surface of the leadframe.
 3. The method of claim 1, wherein themolding includes partially covering the first semiconductor die whileleaving an exposed surface of the first semiconductor die opposite theleadframe with the mold compound.
 4. The method of claim 3, furthercomprising, prior to molding, applying tape to shield the exposedsurface of the first semiconductor die from the mold compound.
 5. Themethod of claim 1, wherein the molding includes fully covering the firstsemiconductor die, the second semiconductor die, and the wire bonds withthe mold compound.
 6. The method of claim 1, wherein the firstsemiconductor die includes a field effect transistor (FET), and thesecond semiconductor die includes a driver integrated circuit (IC),wherein the package forms a power converter including the FET and thedriver IC.
 7. The method of claim 6, wherein the FET is a synchronousFET, the method further comprising arranging a control FET on the firstsurface of the leadframe, wherein the power converter includes thecontrol FET, and wherein the molding includes at least partiallycovering the control FET.
 8. The method of claim 1, wherein the packageis one of an array of molded packages manufactured on an array ofinterconnected leadframes including the leadframe, the method furthercomprising singulating the array of molded packages.
 9. A packagecomprising: a leadframe having first surface and a second surfaceopposing the first surface, the leadframe forming a plurality of leads;a synchronous (sync) field effect transistor (FET) comprising sync FETcontacts; a control FET comprising control FET contacts, wherein thesync FET and control FET are arranged on the first surface of theleadframe such that the sync FET contacts and the control FET contactsare each electrically coupled to at least one of the plurality of leads;a driver integrated circuit (IC) mounted on the second surface of theleadframe; wire bonds electrically connecting the driver IC to theleadframe to form a synchronous buck converter including the driver IC,the control FET, and the sync FET; and mold compound at least partiallycovering the sync FET, the control FET, the driver IC and the wirebonds.
 10. The package of claim 9, further comprising die attachsecuring the driver IC to the second surface of the leadframe, whereinthe die attach also serves as underfill for the sync FET and control FETbetween the sync FET and the control FET and the first surface of theleadframe.